An adhesive pattern (4) is formed in the invention as follows: a photocurable/thermosetting adhesive containing photosensitive prepolymer (A) containing both a carboxyl group and an ethylenically unsaturated bond in a molecule and having an acid number of 30-160 mgKOH/g, an epoxy resin (B) and a photopolymerization initiator (C) as essential ingredients is applied onto a surface of a substrate (1) as an object to be bonded; then a selective pattern exposure to an active energy ray is performed by using a photomask (3); and then unexposed portions are removed through development using an aqueous alkali solution. After that, a sheet member (5) as another object to be bonded is pressure bonded onto the adhesive pattern and the adhesive pattern is thermoset, thereby a pressurized multilayer structure object is obtained.