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发明授权
CN101207103B 半导体封装元件及其制造方法 有权

半导体封装元件及其制造方法
摘要：
本发明提供一种半导体封装元件及其制造方法，该封装元件设有第一绝缘层，且设有多个孔洞于该第一绝缘层的第一表面上。此外，还设有多个封装导线，嵌设于该绝缘层中，与所述孔洞的另一端连接。多个孔洞可作为焊球连接封装导线的定位，使得半导体晶片的信号可以藉由该晶片的导体单元连至所述封装导线，并且经由焊球向外传输信号。该第一绝缘层的材料，以具有弹性模量大于1.0GPa的特性为宜。
摘要（英）：

The invention provides a semiconductor potting element and the manufacturing method thereof. The potting element is provided with a first insulating layer, and a plurality of holes which are positioned on the first surface of the first insulating layer. In addition, a plurality of potting lead wires are embedded on the insulating layer, and are connected with the other ends of the holes. The holes can be used as the locationfor a solder ball to connect the potting lead wires, to ensure the signal of the semiconductor chip to be connected with the potting lead wires through the conductor units of the chip and to be transmitted outward through the solder ball. The material of the first insulating layer with the characteristics of more than 1.0GPa elastic modulus is advisable.

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