利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN101266920A 半导体器件的制造装置及制造方法 失效 - 权利终止

半导体器件的制造装置及制造方法
摘要：
一种半导体器件的制造装置和制造方法，即使在半导体芯片的尺寸不同时，也可以容易地从粘接片剥离半导体芯片。在半导体器件的制造装置中，具有：保持部，对在一个面上粘贴有多个半导体芯片(1)的粘接片(6)进行保持；多个顶起突部(30a、30b)，从粘接片(6)的另一个面侧顶起半导体芯片(1)；以及，滑动机构(33)，使至少一个顶起突部(30b)向可改变顶起突部(30a、30b)间隔的方向滑动。
摘要（英）：

The invention provides a semiconductor member manufacturing device and a manufacturing method that can exfoliate a semiconductor-chip from a bonding chip even if the semiconductor-chip has various size. The device includes a holder for holding the adhesive sheet (6) that a plurality of semiconductor chips (1) are sticked on one surface; two jacking protrusions (30a, 30b) jack the semiconductor chip (1) from another side of the adhesive sheet (6); and a sliding unit (33) that makes at least one jacking protrusion (30b) moving towards to a direction with variation of the jacking protrusions (30a, 30b) interval.

公开/授权文献
0/0