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发明授权
CN101317258B 通过分子黏附进行键合的方法和设备 有权

通过分子黏附进行键合的方法和设备
摘要：
本发明在第一方面涉及通过分子黏附使两个基片彼此键合的方法，其中，将所述基片的表面紧密接触放置，通过所述基片之间的键合前沿的扩展而发生键合，其特征在于，所述方法包括下述步骤：在键合之前，改变一个和/或另一个所述基片的表面状态，以调节所述键合前沿的扩展速度。通过局部地或均匀地加热一个和/或另一个待键合基片的表面，或者进一步通过使一个和/或另一个基片的表面粗糙化而改变表面状态。
摘要（英）：

The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).

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