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发明公开
CN101367158A 二元无铅焊膏 失效 - 权利终止

二元无铅焊膏
摘要：
本发明涉及一种用于电子元器件焊接及表面封装的二元无铅焊膏，它是在微米无铅焊膏基础上添加纳米粉末，该焊膏的组成以质量百分计为：微米无铅焊膏90～99.9％，纳米粉末0.1～10％，其中纳米粉末是普通无铅焊料的纳米粉末，或是金属的纳米粉末，或是SiC、SiN、BN、Al2O3的纳米粉末。本发明具有普通无铅焊膏的所有基本性能，并且降低了成本，降低了熔点。与普通锡铅系焊膏相比，本发明不含有毒元素铅，特别适用于微电子工业中的电子封装技术。
摘要（英）：

The invention relates to binary lead-free solder paste for welding and surface mounting of electronic components. Nanopowder is added based on micron lead-free solder paste; and the solder paste comprises the following compositions in percentage by mass: 90 to 99 percent of micron lead-free solder paste and 0.1 to 10 percent of the nanopowder, wherein the nanopowder is nanopowder of ordinary lead-free solder paste or nanopowder of metal or nanopowder of SiC, SiN, BN, and AL2O3. The binary lead-free solder paste has the entire basic performances of the ordinary lead-free solder paste, and reduces the cost and the melting point. Compared with the prior tin lead solder paste, the binary lead-free solder paste does not contain toxic element lead, and is particularly suitable for electronic packaging technology in the microelectronic industry.

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