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发明公开
CN101369561A 半导体芯片封装件、电子装置及其制造方法 无效 - 撤回

半导体芯片封装件、电子装置及其制造方法
摘要：
本发明提供了一种半导体芯片封装件、电子装置及其制造方法。所述半导体芯片封装件包括：半导体芯片，包括具有键合焊盘的第一表面、面向第一表面的第二表面和侧壁；模制延伸部分，围绕半导体芯片的第二表面和侧壁；再分布图案，从键合焊盘延伸到模制延伸部分上，并电连接到键合焊盘；凸点焊球，位于再分布图案上；模制层，被构造为覆盖半导体芯片的第一表面和模制延伸部分，同时暴露每个凸点焊球的一部分。模制层在彼此相邻的凸点焊球之间具有凹月牙表面。
摘要（英）：

The invention provides a semiconductor chip package, electronic means and a menufacturing method thereof. The semiconductor chip package includes a semiconductor chip including a first surface having bonding pads, a second surface facing the first surface, and sidewalls; a molding extension part surrounding the second surface and the sidewalls of the semiconductor chip; redistribution patterns extending from the bonding pads over the molding extension part, and electrically connected to the bonding pads; bump solder balls on the redistribution patterns; and a molding layer configured to cover the first surface of the semiconductor chip and the molding extension part, while exposing portions of each of the bump solder balls. The molding layer has concave meniscus surfaces between the bump solder balls adjacent to each other.

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