The invention discloses an induction melt-back technique of an interconnection indium column of an infrared focal plane detector. The melting of the indium column is realized through the induced current of metal in an alternating electromagnetic field, a mercury cadmium telluride material is not heated while melting the indium column, so that the interconnection intensity can be enhanced while theperformance degradation of the mercury cadmium telluride chip at high temperature can be avoided, and the problem of melt-back of the indium column in the focal plane technique is well solved.