To inhibit the outflow of a sealing resin at a crossing section with a wiring pattern. The solultion is as following: In a semiconductor module, the semiconductor module has a semiconductor chip 112, a substrate loading the semiconductor chip and forming the wiring pattern 103 connected to the semiconductor chip and a solder resist 109 and the sealing resin 114 sealing the semiconductor chip. In the semiconductor module, a solder-resist pattern 109 is opened so as to arrange the loading region of the semiconductor chip and the connecting section of the semiconductor chip and the wiring pattern while the end section of an outer periphery surrounds the outer peripheries of the loading region and the connecting section so as to work as the antirunning section of the sealing resin and the wiring pattern is crossed with the solder-resist pattern. In the semiconductor module, a wiring-pattern extending section extended from the wiring pattern along the outer periphery of the solder-resist pattern is formed on the outer peripheral side of the solder-resist pattern, and sections up to the end section of the outer periphery of the solder-resist pattern and the end section of the outer periphery of the wiring-pattern extending section are filled with the sealing resin.