A method for electrically connecting an electronic component with high reliability of electrical connection after the electrical connection, enabling correct counting of captured conductive particles and a joined body are provided. The electronic component connecting method includes a mixing step of mixing a dispersing solvent, an adhesive resin dissolvable into the dispersing solvent, conductiveparticles, and insulating particles whose size is smaller than that of the conductive particles thereby to prepare an anisotropic conductive adhesive and a heating/pressing step of opposing a substrate terminal of a substrate and a component terminal of an electronic component with the anisotropic conductive adhesive interposed therebetween, applying heat and pressing-force to the substrate and the electronic component, holding the conductive particles between the substrate terminal and the component terminal, and thereby deforming the conductive particles. The pressing-force at the heating/pressing step is weaker than both the breakage pressing-force by which the conductive particles are broken and the deformation pressing-force by which the particle size of the conductive particles becomes equal to that of the insulating particles.