The invention discloses a semiconductor carbon dioxide supercritical sweeping and cleaning machine. A cleaning cavity is internally provided with a magnetic-driven rotating device. Carbon dioxide supercritical fluid has no surface stress, low glutinousness as well as strong diffusivity and dissolving capacity, thereby being capable of performing effective clean and supercritical drying for fine structures on silicon wafers. The semiconductor carbon dioxide supercritical sweeping and cleaning machine has the main structure of the cleaning cavity, and can achieve an ideal cleaning effect by additionally arranging the magnetic-driven rotating structure and a matched nozzle in the design. The development and manufacture of the semiconductor carbon dioxide supercritical sweeping and cleaning machine can greatly promote the development of the semiconductor cleaning technology.