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发明公开
CN101765908A 半导体装置的制造方法、半导体装置以及曝光装置 无效 - 驳回

半导体装置的制造方法、半导体装置以及曝光装置
摘要：
本发明提供设置有平坦化层、同时使半导体层上的加工容易的半导体装置的制造方法。通过该方法提供适当地制造的半导体装置以及适当地使用于该制造方法中的曝光装置。本发明的半导体装置的制造方法，其为在基板上具有半导体层、和平坦化层的半导体装置的制造方法，当俯视基板时所述平坦化层为包围半导体层的形状，所述制造方法包括：在基板上形成半导体层的工序；在半导体层上形成感光性有机膜的工序，所述感光性有机膜具有与半导体层的光吸收波段重复的感光波段；和将该感光波段的光从基板侧对感光性有机膜曝光，并对感光性有机膜进行显影而形成平坦化层的工序。
摘要（英）：

Disclosed is a method for manufacturing a semiconductor device, which makes processing on a semiconductor layer easier while providing a planarization layer. Also disclosed are a semiconductor device suitably manufactured by such a method, and an exposure apparatus suitably used in such a method. Specifically disclosed is a method for manufacturing a semiconductor device which has, on a substrate, a semiconductor layer and a planarization layer having a shape surrounding the semiconductor layer when the substrate is viewed in plan. This method for manufacturing a semiconductor device is characterized by comprising a step for forming a semiconductor layer on a substrate, a step for forming, on the semiconductor layer, a photosensitive organic film having a photosensitive wavelength range overlapping the light absorption wavelength range of the semiconductor layer, and a step for forming a planarization layer by exposing the photosensitive organic film with light in the photosensitive wavelength range from the substrate side and developing the photosensitive organic film.

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