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CN101998779A 层叠型陶瓷电子元器件及其制造方法 无效 - 撤回

层叠型陶瓷电子元器件及其制造方法
摘要：
在多层陶瓷基板的表层部形成有包含Ag的导体图案、该Ag在烧成时扩散的情况下，表面上的导体图案之间容易形成Ag的迁移路径，可靠性下降。为获得将要被烧成的未烧成的陶瓷层叠体(12)，将第一陶瓷生坯层(1a)配置于表层部，将第二陶瓷生坯层(2a)配置于内层部，然后进行层叠，所述第一陶瓷生坯层(1a)具有包含Ag的第一导体图案(5)、(7)、(9)，并且含有包含第一玻璃成分的第一陶瓷材料，所述第二陶瓷生坯层(2a)具有包含Ag作为主要成分的第二导体图案(6)、(8)，并且含有包含第二玻璃成分的第二陶瓷材料，且具有与第一陶瓷生坯层(1a)相比在烧成时Ag更容易扩散的组成。将该未烧结陶瓷层叠体(12)烧成，获得多层陶瓷基板(14)。
摘要（英）：

A conductor pattern layer comprising Ag is formed in a surface layer part of a multilayered ceramic substrate; a migration path of Ag is easily formed between the conductor patterns on the surface under the condition that Ag is diffused during sintering, and the reliability is reduced. In order to form a green ceramic laminate (12) to be fired, first ceramic green layers (1a) which include first conductor patterns (5), (7) and (9) including Ag as a main component and which include a first ceramic material including a first glass component are disposed in surface layer portions. Second ceramic green layers (2a) which include second conductor patterns (6) and (8) including Ag as a main component, which include a second ceramic material containing a second glass component, and which include a composition in which Ag diffuses than more easily in the first ceramic green layer (1a) during firing are disposed in inner layer portions. The green ceramic laminate (12) is fired to produce a multilayer ceramic substrate (14).

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