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发明公开
CN102005418A 半导体装置及其制造方法 失效 - 权利终止

半导体装置及其制造方法
摘要：
本发明涉及半导体装置及其制造方法，是在具有半导体基片、与该半导体基片电连接的以金属作为主构成材料的多根引线、把该半导体基片密封的密封体的半导体装置中，提供一种上述引线与密封体(模制密封体)的粘合性提高，不产生剥离的半导体装置。在具有半导体基片(5)、与该半导体基片电连接的以金属作为主构成材料的多根引线(3)、把该半导体基片密封的密封体(2)的半导体装置中，为了提高上述引线(3)与密封体(模制密封体)的粘合性，作为引线(3)的表面材料与密封体(2)的组合，采用晶格整合性良好的材料组合，采用并苯类作为主构成材料的密封体(2)。
摘要（英）：

The invention relates to a semiconductor device and a method for manufacturing same. The semiconductor device in which an adhesion between a lead and a sealing body (mold sealing body) is improved to prevent the peering is provided. In a semiconductor device having a semiconductor chip (5), a plurality of leads (3) electrically connected to the semiconductor chip and mainly made of metal and a sealing body (2) for sealing the semiconductor chip, in order to improve the adhesion between the lead (3) and the sealing body (mold sealing body), a material combination with good lattice matching is used as a combination of a surface material of the lead (3) and a material of the sealing body (2), and the sealing body (2) mainly made of acene is used.

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