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发明公开
CN102013402A 粘接带和引线框架的层压方法 无效 - 撤回

粘接带和引线框架的层压方法
摘要：
本发明总体涉及粘接带和引线框架的层压方法，并且更具体地涉及可以减小制造半导体装置的粘接带被贴附至引线框架的热层压工艺之后引线框架的翘曲的粘接带和引线框架层压方法，且其满足层压工艺所要求的所有性能，并且克服了例如来自在现有技术半导体装置制造工艺中已经被使用过的粘接带的粘接剂残留物的产生和密封树脂的泄漏的缺点。为此，根据本发明的粘接带和引线框架的层压方法的特征在于，粘接带表面的层压温度和引线框架表面的层压温度在引线框架和制造电子部件的粘接带的层压工艺中相互不同，并且优选引线框架表面的层压温度低于粘接带表面的层压温度1～200℃。
摘要（英）：

This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200 DEG C.

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