The invention provides a method for forming a contact hole, which comprises the following steps: providing a front end device layer; forming a protective layer at the other side of the front end device layer which is opposite to one side of the front end device layer, which is manufactured with a device structural layer; depositing a contact etch stopping layer on the surface of the front end device layer; forming an interlayer dielectric layer on the surface of the contact etch stopping layer; forming a photoresist layer with a pattern on the surface of the interlay dielectric layer; and taking the photoresist layer with the pattern as a masking film to etch the interlayer dielectric layer and forming and form the contract hole.