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发明公开
CN102148224A LED模块 无效 - 撤回

LED模块
摘要：
本发明公开了一种LED模块。按照一个实施例，LED模块包括基板、互连线和LED封装。所述互连线形成于基板的上表面上。LED封装安装在基板上。LED封装包括布置成相互分开并与所述互连线的相互绝缘部分连接的第一引线框架和第二引线框架。LED封装包括设置在第一引线框架和第二引线框架上方的LED芯片。LED芯片的一个端子与第一引线框架连接，另一个端子与第二引线框架连接。另外，LED封装包括覆盖第一引线框架和第二引线框架的每一个的上表面、下表面和边缘表面的一部分的树脂体，树脂体还覆盖LED芯片，但是露出所述下表面和所述边缘表面的剩余部分。树脂体的外观是LED封装的外观。
摘要（英）：

The invention discloses an LED module. According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

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