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发明公开
CN102299083A 薄半导体封装及其制造方法 有权

薄半导体封装及其制造方法
摘要：
本发明涉及薄半导体封装及其制造方法。所述方法包括提供具有可移除基底的引线框，可移除基底具有附接到引线框的第一表面的附接表面。引线框由导电片形成且具有从引线框边界向引线框的中心区域向内延伸的引线。在中心区域处在可移除基底上安装半导体管芯。半导体管芯具有管芯焊盘位于其上的连接焊盘表面，连接焊盘表面附接到可移除基底的附接表面。以第一密封材料密封引线框和管芯，使引线框夹持在第一密封材料和可移除基底之间。从引线框移除可移除基底以暴露引线框的第一表面，然后管芯焊盘电连接到各引线。以第二密封材料密封管芯和引线框，使引线框和管芯夹持在第一和第二密封材料之间。移除第一密封材料的一部分以减小封装的厚度并暴露引线。
摘要（英）：

A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

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