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发明公开
CN102313750A 晶片式LED检查装置 有权

晶片式LED检查装置
摘要：
本发明课题为提供一种检查装置，可正确地侦测存在于晶片式LED(CHIPLED)的密封树脂部的不透光性异物。课题的解决方法为，具备支持晶片式LED50的支持构件5；照亮晶片式LED50表面的上部照明机构10；拍摄晶片式LED50的表面侧的影像的相机6；解析拍摄影像，并判定异物的有无的判定部8。上部照明机构10，由：具备呈穹顶状的本体及配置于该穹顶本体内的复数个光源，凭借从穹顶本体的下面开口部往下方照射出来的光线间接照亮其下方的第1照明部；与具备呈环状的本体及配置于环状本体下面的复数个光源，凭借从此光源照射出来的光线直接照亮其下方的第2照明部所构成。相机6配置于第1照明部的上方，通过其拍摄用开口部，拍摄晶片式LED50的表面影像。
摘要（英）：

The invention provides a detection device capable of accurately detecting opaque materials that are located at sealed resin portions of chip LEDs. The detection device comprises a support member 5 for supporting a chip LED 50; an upper illuminating mechanism 10 for illuminating the surface of the chip LED 50; a camera for shooting images of the surface of the chip LED 50; and a determining portion 8 for making an analysis of the shot images and determining whether foreign matters exist. The upper illuminating mechanism 10 is composed of a first illuminating portion and a second illuminating portion, wherein the first illuminating portion has a dome-shaped body and a plurality of light sources configured in the dome-shaped body and indirectly illuminates the part therebelow through lights that are emitted downwardly from an opening portion below the dome-shaped body, and the second illuminating portion has an annular body and a plurality of light sources configured below the annular body and directly illuminates the part therebelow through lights that are emitted by the light sources. The camera 6 is configured above the first illuminating portion to shoot images of the surface of the chip LED 50 through a shooting-purpose opening portion.

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