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发明公开
CN102403291A 半导体零件及制造方法 有权

半导体零件及制造方法
摘要：
一种半导体零件以及用于制造半导体零件的方法，其中半导体零件包括叠层型半导体管芯。根据实施例，半导体零件包括具有零件接收区和多个键合焊盘的衬底。半导体芯片被附接于零件接收区。电连接器与半导体芯片和衬底耦连。第二半导体芯片被安装或被附接于电连接器的一个端部从而使该端部定位于半导体芯片之间。第二电连接器被耦连于第二半导体芯片和衬底之间。第三半导体芯片被安装于第二电连接器之上或者被附接与第二电连接器使得一部分在第二和第三半导体芯片之间。
摘要（英）：

The utility model relates to a semiconductor part and a method for making the same. The semiconductor part comprises a laminated type semiconductor core. According to the utility model, the semiconductor part comprises a substrate having a part receiving section and a plurality of linking pads. The semiconductor chip is attached to the part receiving area. The electric connector is coupled to the semiconductor chip and the substrate. The second semiconductor chip is installed or attached to one end of the electric connector, thereby making the end positioned between the semiconductors chips. The second electric connector is coupled between the second semiconductor chip and the substrate. The third semiconductor chip is installed upon the second electric connector or attached to the second electric connector, thereby making one part between the second and third semiconductor chips.

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