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CN102450112A 连接方法、连接结构和电子装置 失效 - 放弃专利权

连接方法、连接结构和电子装置
摘要：
本发明提供一种连接方法和电子装置，其中可以简化制造工艺并且可以低成本生产使用粘合剂的连接结构。根据本发明的连接方法包括：步骤(a1)，制备其上设置有将使用粘合剂进行接合的电极(12，22)的基板(10，21)；步骤(b1)，以有机膜(15)涂覆基板上的将利用粘合剂连接的电极(12，22)以防止电极氧化；步骤(c1)，去除有机膜或减小有机膜的厚度；以及步骤(c1)之后的步骤(d1)，利用主要包含热固树脂的粘合剂(30)将电极彼此接合以使各电极彼此电连接。
摘要（英）：

Provided are a connection method and an electronic device, wherein the manufacturing process can be simplified, and an adhesive connection structure can be realized at a low cost. The connection method is comprised of a process (a1) for preparing substrates (10, 21) on which electrodes (12, 22) to be bonded by an adhesive are provided; a process (b1) for coating the electrodes (12, 22) to be connected by an adhesive on the substrates with an organic film (15) to prevent the electrodes from oxidizing; a process (c1) for removing the organic film or reducing the thickness of the organic film; and a process (d1) for bonding the electrodes to each other by an adhesive (30) mainly composed of a thermosetting resin, to electrically connect the electrodes to each other after the process (c1).

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