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发明公开
CN102509693A 一种采用铝线作为连接线的塑封电子元器件的化学开封方法及所用腐蚀液的配制方法 无效 - 撤回

一种采用铝线作为连接线的塑封电子元器件的化学开封方法及所用腐蚀液的配制方法
摘要：
本发明涉及一种采用铝线连接的塑封电子元器件的化学开封方法。一种采用铝线作为连接线的塑封电子元器件的化学开封方法，其特征在于包括如下步骤：准备样品、用腐蚀液腐蚀样品、用清洗剂清洗样品，其中所述腐蚀液的配制方法为：将质量分数为98％的浓硫酸倒入耐酸耐高温容器，然后对耐酸耐高温容器进行加热制得，加热温度为180℃～250℃。本发明与现有技术相比，具有如下优点：实现对采用铝线作连接线的失效电子元器件的有效开封，保证电子元器件内部芯片表面整洁和铝连接线的完整。
摘要（英）：

The invention relates to a chemical unsealing method of a plastic package electronic component which is connected by using an aluminum wire. The chemical unsealing method of the plastic package electronic component which uses the aluminum wire as a connecting wire is characterized by comprising the following steps of: preparing a sample, etching the sample by using an etching solution, and cleaning the sample by using a cleaning agent, wherein the preparation method of the etching solution comprises the following steps of: pouring concentrated sulfuric acid of which the mass fraction is 98 percent into an acid-resistant and high-temperature-resistant container, and heating the acid-resistant and high-temperature-resistant container at a heating temperature of 180 to 250 DEG C to obtain the etching solution. Compared with the prior art, the chemical unsealing method disclosed by the invention has the advantages that: a disabled electronic component which uses the aluminum wire as the connecting wire can be effectively unsealed, and the neatness of the surface of an internal chip of the electronic component and the integrity of the aluminum connecting wire are ensured.

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