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发明公开
CN102573336A 多层电路板的制作方法和用于多层电路板层的压合结构 有权 转让

多层电路板的制作方法和用于多层电路板层的压合结构
摘要：
本发明的实施例公开了一种多层电路板的制作方法和用于多层电路板层的压合结构，涉及电路板制作领域，为能够有效提高绝缘层厚度的均匀性而发明。本发明实施例提供的多层电路板的制作方法，包括：形成用于相邻线路层电连接的导电柱层；在所述导电柱层上依次叠放半固化片和离型膜，其中所述离型膜的厚度为200至500微米，随后进行层压处理以形成绝缘层；在所述绝缘层上制作线路层。本发明可用于多层电路板的制作中。
摘要（英）：

The embodiment of the invention discloses a manufacturing method of a multilayer circuit board and a laminated structure for the multilayer circuit board, relating to the field of circuit board manufacturing, and being capable of effectively improving the uniformity of the thickness of an insulating layer. The manufacturing method of the multilayer circuit board comprises the following steps of: forming a conductive column layer for electrically connecting adjacent circuit layers; stacking a prepreg and a release film on the conductive column layer in turn, and laminating to form the insulating layer, wherein the thickness of the release film is 200 to 500 microns; and manufacturing a circuit layer on the insulating layer. The manufacturing method can be used for manufacturing the multilayer circuit board.

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