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发明授权
CN102687255B 凹陷半导体衬底 有权 转让

凹陷半导体衬底
摘要：
本公开内容的实施例提供一种装置，该装置包括：半导体衬底，具有第一表面，与第一表面相对设置的第二表面，其中第一表面的至少部分被凹陷以形成半导体衬底的凹陷区域，以及一个或者多个过孔，形成于半导体衬底的凹陷区域中以在半导体衬底的第一表面与第二表面之间提供电或者热通路；以及裸片，耦合到半导体衬底，该裸片电耦合到在半导体衬底的凹陷区域中形成的一个或者多个过孔。可以描述和/或要求保护其它实施例。
摘要（英）：

Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.

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