Provided are a tape for wafer processing which maintains satisfactory sensor detectability even when the adhesive agent layer is thin (10µm or less, and particularly 5µm or less), and provides satisfactory productivity and testing accuracy; and the production method for the tape. The tape (10) for wafer processing is provided with a long release film (11), an adhesive agent layer 12 (22), and an adhesive film (13)(23a, 23b). A circular first perforated section (26) is formed along the circumference of the label-shaped adhesive agent layer (22) on a surface (11a) of the release film (11). The first perforated section (26) is formed so that, with respect to the laminated area in which the release film (11) and the adhesive film (13)(23a) are laminated, if (A%) represents the transmittance of wavelengths between 600 and 700nm occurring at laminated parts (27b) corresponding to positions where the first perforated section (26) is present, and (B%) represents the transmittance of wavelengths between 600 and 700nm, occurring at laminated parts (27a) corresponding to positions where the first perforated section (26) is not present, the difference (C) between the transmittances is at least 0.1%.