Copper conductor members or other copper-based workpieces are welded using a suitable copper alloy material that is reactive with the joining surfaces of the copper members. The reactive metal material may be applied as a thin metal foil strip between assembled facing joining surfaces. The members are pressed together against the reactive material and electrical resistance heated in forming the weld. Practices are adapted for forming many such welds in the pairs of facing ends of conductor bars or wires assembled, for example, in slots in a stator for a vehicle traction motor. Practices are disclosed for shaping and automated placement of suitably sized and shaped foils of reactive metal. Practices are also disclosed for use of a resistance welding tool in aligning and heating the many pairs of conductors to be welded.