The invention discloses a flow choking device for a wave soldering nozzle, which comprises an upper baffle plate and a lower baffle plate, wherein mounting bases a and convex heads are arranged on the upper baffle plate; the mounting bases a are arranged on one side of the upper baffle plate, and are positioned at two ends of the upper baffle plate respectively; the mounting base a at one end is provided with an inclined hole, and the other end is provided with a round hole; the lower baffle plate is milled with recesses, and is provided with mounting bases b; the mounting bases b are arranged on one side of the lower baffle plate, are positioned at two ends of the lower baffle plate respectively, and are both provided with round holes; and the upper baffle plate and the lower baffle plate are assembled through the convex heads and the recesses to form a two-layer telescopic structure. The device uses no oxidization resistance reducing agent, and achieves effects capable of being realized by chemical reactions, through a physical method, so that the oxidization reaction is reduced, and the environment is protected; the contact area with oxygen is reduced so as to decrease oxidization of tin; and tin slag is not caked, so that convenience is brought for recycling, and the cost is effectively reduced; a tin spraying height can be increased to reduce the rotating speed of a motor, so that the oxidization of the tin and the abrasion of a hearth and a motor impeller are reduced; and the device is convenient to dismount and maintain.