The invention provides a conformal microstructure transfer method. The method at least includes: providing an XOI (X on insulator) substrate comprising bottom silicon, an buried oxide layer and a top X nano-film sequentially from top to bottom, coating the top X nano-film with dumbbell-shaped photoresist used as a mask, and etching to obtain a dumbbell-shaped microstructure; corroding the buried oxide layer by hydrofluoric acid solution or BOE (buffer oxide etch) solution until a middle patterned microbelt part of the microstructure is totally suspended in air and part of the buried oxide layer not completely corroded below two end areas of the microstructure remains, and forming fixed junctions; and providing a base plate to contact with the microstructure, and quickly lifting the base plate to transfer the microstructure to the base plate. The microstructure nano-film is fixed according to the simple design of graph fixation by ends, full conformal transfer is achieved, complexity in conformal transfer process is lowered greatly, and process cost is lowered.