The subject of the present invention is in particular a device (2) for stressing an integrated circuit (1) comprising an electronic chip (10) mounted in a package (12), said device comprising a source (20) of thermal stress. The device (2) also comprises a thermally conductive coupling member (22) intended to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) comprises an end (220) having a geometry suited to introduction into an aperture having a preset geometry, which is to be produced in the package (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10).