A piezoelectric vibration device that is highly reliable, and in which a piezoelectric element and a support member etc. do not easily break due to the concentration of stress in electrical connections is provided. The piezoelectric vibration device (1) in which a piezoelectric element (7) is bonded to a piezoelectric element bonding surface (2a) of a support member (2), the piezoelectric element (7) comprises a first drive electrode (9) formed on a first main surface (8a), and a second drive electrode (10) formed on a second main surface (8b), and the first drive electrode (9) is electrically connected to a first wiring electrode (3) formed on the piezoelectric element bonding surface (2a) of the support member (2), and the piezoelectric element (7) is bonded to the support member (2) by means of a first bonding material layer (5).