The invention discloses a coaxial through chip connection mode. A method for physical and electrical interconnection of two chips comprises: aligning a conductive contact on a first chip with a corresponding conductive contact on a second chip, wherein the conductive contact on the first chip is a rigid material, and the conductive contact on the second chip is a tough material relative to the rigid material; contacting the aligned conductive contact on the first chip with the corresponding conductive contact on the second chip; heating the contacts of the first and second chips to a temperature lower than the liquefaction temperature of the rigid material, applying pressure to the first and second chips simultaneously so as to allow the rigid material to penetrate the tough material to form coductive connection between the two materials; and cooling the contacts of the first and second chips to ambient temperature after the formation of the conductive connection.