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发明公开
CN103606527A 半自动晶圆植球设备 有权 许可 质押

半自动晶圆植球设备
摘要：
一种半自动晶圆植球设备，包括底部架台，在底部架台上设有晶圆上料/下料机构、晶圆传送机械手、晶圆校准机构、晶圆搭载台、晶圆印刷机构、晶圆植球机构和CCD对位系统；晶圆上料/下料机构、晶圆传送机械手和晶圆校准机构沿y轴方向顺序设置在底部架台的一端，晶圆搭载台、晶圆印刷机构、晶圆植球机构和CCD对位系统沿x轴方向顺序设置在底部架台上，其中的晶圆搭载台临近晶圆传送机械手设置，晶圆植球机构和CCD对位系统组合在一起临近晶圆印刷机构设置。本发明采用CCD自动对位，保证了对位的准确性和快速性，可以对应6英寸、8英寸和12英寸晶圆，对应不同晶圆只需更换设备治具和载具即可。
摘要（英）：

The invention discloses a semi-automatic wafer ball mounting device. The ball mounting device comprises a bottom stand, wherein a wafer charging/discharging mechanism, a wafer conveying mechanical arm, a wafer calibrating mechanism, a wafer carrying table, a wafer printing mechanism, a wafer ball mounting mechanism and a CCD (Charge Coupled Device) aligning system are arranged on the bottom stand. The wafer charging/discharging mechanism, the wafer conveying mechanical arm and the wafer calibrating mechanism are sequentially arranged at one end of the bottom stand along the y-axis direction; the wafer carrying table, the wafer printing mechanism, the wafer ball mounting mechanism and the CCD aligning system are sequentially arranged on the bottom stand along the x-axis direction; the wafer carrying table is arranged near the wafer conveying mechanical arm; the wafer ball mounting mechanism and the CCD aligning system are combined together near the wafer printing mechanism. Through automatic CCD alignment, the accuracy and the rapidness of alignment are guaranteed; the ball mounting device is applicable to different wafers of 6-inch, 8-inch and 12-inch just by means of replacing jigs and carriers.

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