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发明公开
CN103724944A 一种无卤环氧树脂组合物及其用途 无效 - 驳回

一种无卤环氧树脂组合物及其用途
摘要：
本发明公开了一种无卤环氧树脂组合物以及使用其制作的预浸料与覆铜箔层压板，该环氧树脂组合物包含以下组分：（A）无卤环氧树脂；（B）作为第一固化剂的苯乙烯与马来酸酐共聚物（SMA）；（C）作为第二固化剂的含磷化合物。用所述无卤环氧树脂组合物制成的预浸料和覆铜箔层压板，具有良好的介电性能，同时加工性良好，工艺操作简便，并且耐湿热性能表现良好。
摘要（英）：

The invention discloses a halogen-free epoxy resin composition, and a prepreg and copper foil clad laminated board prepared from the same. The epoxy resin composition comprises the following components: (A) halogen-free epoxy resin; (B) styrene-maleic anhydride copolymer (SMA) used as a first curing agent; and (C) phosphorus-containing compound used as a second curing agent. The prepreg and copper foil clad laminated board prepared from the halogen-free epoxy resin composition have the advantages of favorable dielectric properties, favorable processability, simple technological operation and favorable moisture and heat resistance.

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