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发明公开
CN103779303A 凸点式封装及其形成方法 无效 - 撤回

凸点式封装及其形成方法
摘要：
本发明涉及凸点式封装及其形成方法。根据本发明的实施例，半导体封装包括半导体芯片和凸点。半导体芯片具有主表面上的接触垫。凸点被置于半导体芯片的接触垫上。焊料层被置于凸点的侧壁上。
摘要（英）：

The invention relates to a bump package and methods of formation thereof. In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a contact pad on a major surface. The bump is disposed on the contact pad of the semiconductor chip. A solder layer is disposed on sidewalls of the bump.

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