利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN103781289A 电子装置及其制造方法 无效 - 撤回

电子装置及其制造方法
摘要：
在制造电子装置的方法中，热塑性树脂膜夹置在具有电极的电子部件和具有基板的安装构件之间，以制造层压组件。过孔形成在所述热塑性树脂膜中且填充有导电浆料。作为凹陷部的通孔形成在以下至少一个区域中：基板中面向热塑性树脂膜的区域，以及形成在基板上的连接部中且不与过孔中的导电浆料接触的区域。加热层压组件并且同时在其层压方向上按压层压组件，从而烧结过孔中的导电浆料。这就制造了每个过孔中的层间连接构件和所述电子装置。
摘要（英）：

In a method of manufacturing an electronic device, a thermoplastic resin film is sandwiched between an electronic component having electrodes and a mounting member having a substrate to manufacture a lamination assembly. Via holes are formed in the thermoplastic resin film and filled with conductive paste. Through holes as depressed sections are formed in at least one of an area in the substrate, which faces the thermoplastic resin film, and an area in a connecting section formed on the substrate and which is not in contact with the conductive paste in the via holes. The lamination assembly is heated and pressed in a lamination direction, thereof, simultaneously in order to sinter the conductive paste in the via holes. This manufactures an interlayer connection member in each via hole and the electronic device.

0/0