The present invention relates to a micro-electro-mechanical system device manufacturing method, which comprises: S1: providing a first chip, wherein the first chip comprises a micro-electro-mechanical system device layer having a movable sensitive part and a first electrical bonding point; S2: providing a second chip, wherein the second chip comprises a substrate having a first surface and a second surface, an isolation part arranged on the substrate and extending toward the first surface direction from the second surface, and a second electrical bonding point arranged on the second surface, the substrate is further provided with an electrical connection part electrically connected with the second electrical bonding point, and the isolation part is enclosed surrounding the electrical connection part; S3: bonding the first chip and the second chip, making the second surface face the micro-electro-mechanical system device layer, and bonding the first electrical bonding point and the second electrical bonding point; S4: carrying out thinning operation on the substrate of the bonded second chip on the first surface so as to expose the isolation part; and S5: forming an electrical connection layer electrically connected with the external circuit on the first surface of the thinned substrate.