Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper foil is removed by etching. In the surface-treated copper foil for copper-clad laminate, roughening particles are formed on the surface of the copper foil by means of a roughening treatment. The average roughness (Rz) of the roughening treatment surface is 0.5-1.3 [mu]m. The gloss of the roughening treatment surface is 0.5-68, and the ratio (A/B) of the surface area (A) of the roughening particles to the area (B) obtained when the roughening particles are viewed in plan view from the copper foil surface side, is 2.00-2.45.