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发明公开
CN104080604A 铜箔复合体、以及成形体及其制造方法 有权

铜箔复合体、以及成形体及其制造方法
摘要：
本发明的目的在于提供一种即便进行压制加工这样的不同于单轴弯曲的苛刻（复杂）的变形也可防止铜箔破裂、加工性优异、进而长期稳定地发挥耐蚀性和电接点性能的铜箔复合体、以及其成形体及其制造方法。本发明涉及铜箔复合体以及其成形体及其制造方法，所述铜箔复合体是铜箔与树脂层层叠而成的铜箔复合体，在将铜箔的厚度设为t2（mm），将拉伸应变4%时的铜箔的应力设为f2（MPa），将树脂层的厚度设为t3（mm），将拉伸应变4%时的树脂层的应力设为f3（MPa）时，满足式1：（f3×t3）/（f2×t2）≥1，并且在将铜箔与树脂层的180°剥离粘接强度设为f1（N/mm），将铜箔复合体的拉伸应变30%时的强度设为F（MPa），将铜箔复合体的厚度设为T（mm）时，满足式2：1≤33f1/（F×T），且在铜箔中的未层叠有树脂层的面，形成有厚度0.2～3.0μm的Sn层。
摘要（英）：

The objective of the present invention is to provide: a copper foil composite that prevents the copper foil from splitting even during extreme (complicated) deformation differing from uniaxial bending such as press working or the like, has superior workability, and furthermore exhibits corrosion resistance and electrical contact performance stably over the long term; a molded body thereof; and a method for producing same. The copper foil composite results from laminating a copper foil and a resin layer, when the thickness of the copper foil is t2 (mm), the stress on the copper foil at a tensile strain of 4% is f2 (MPa), the thickness of the resin layer is t3 (mm), and the stress on the resin layer at a tensile strain of 4% is f3 (MPa), formula 1, (f3*t3)/(f2*t2)>=1, is satisfied, when the 180 DEG peel (bond) strength between the copper foil and the resin layer is f1 (N/mm), the strength of the copper foil composite at a tensile strain of 30% is F (MPa), and the thickness of the copper foil composite is T (mm), formula 2, 1<=33f1/(F*T), is satisfied, and an Sn layer having a thickness of 0.2-3.0 [mu]m is formed at the surface of the copper foil that is not laminated to the resin layer.

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