利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN104169367A 糊状封装剂及封装方法 无效 - 撤回

糊状封装剂及封装方法
摘要：
本发明提供一种即使使用水性介质也可以缩短封装、成型周期的糊状封装剂及封装方法。用于成型并封装器件的糊状封装剂含有共聚聚酰胺类树脂和水性介质。共聚聚酰胺类树脂可以具有结晶性，共聚聚酰胺类树脂的熔点或软化点可以为75～160℃。共聚聚酰胺类树脂可以为多元共聚物，例如二元共聚物或三元共聚物。此外，共聚聚酰胺类树脂可以含有来源于具有C8-16亚烷基的长链成分(选自C9-17内酰胺及氨基C9-17链烷羧酸中的至少一种成分)的单元。糊状封装剂可以进一步含有增稠剂[例如(甲基)丙烯酸类聚合物]。
摘要（英）：

Provided are a sealant paste and a sealing method whereby it is possible to shorten the sealing/forming cycle even when an aqueous medium is used. The sealant paste is for molding and sealing a device, and contains a copolymer polyamide resin and an aqueous medium. The copolymer polyamide resin may be crystalline, and the melting point or softening point of the copolymer polyamide resin may be 75-160 DEG C. The copolymer polyamide resin may be a multi-component copolymer, e.g., a binary copolymer or a ternary copolymer. In addition, the copolymer polyamide resin may contain a unit derived from a long-chain component (at least one component selected from among C9-17 lactam and amino C9-17 alkane carboxylic acid) that has a C8-16 alkylene group. The sealant paste may additionally contain a thickening agent (for example, a (meth)acrylic acid polymer).

0/0