The invention relates to the technical field of printed circuit boards, aims at solving the problems that an embedded type circuit board is inconvenient to slot and the thickness of the existing embedded type circuit board is difficultly reduced in the prior art, and discloses a manufacture method of a novel embedded type circuit board. The manufacture method of the novel embedded type circuit board includes following steps: S1, punching a groove in an insulating plate; S2, fixedly installing an electronic element in the groove; S3, manufacturing an electric conducting layer on the surface of the insulating plate; S4, manufacturing a graphic circuit on the electric conducting layer. The manufacture method of the novel embedded type circuit board achieves simple and convenient slotting in production of the embedded type circuit board by optimizing the structure of the embedded type circuit board and changing manufacture steps, and reduces the overall thickness of the embedded type circuit board.