利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN104347527A 光学指纹传感器芯片封装玻璃光栅及其制作方法 有权

光学指纹传感器芯片封装玻璃光栅及其制作方法
摘要：
本发明公开了一种光学指纹传感器芯片封装玻璃光栅及其制作方法，将光栅做在玻璃上，光学指纹传感器芯片感光单元加工完的晶圆封装时，直接将玻璃贴到所述晶圆上，感光单元对应开孔，光栅的不透光的成分为金属，电路部分被金属覆盖。结构和工艺简单、精度高。
摘要（英）：

The invention discloses an optical fingerprint sensor chip packaging glass grating and a manufacturing method for the same. A grating is generated on glass, and when a wafer machined by optical fingerprint sensor chip light sensing units is packaged, the glass is directly attached to the wafer, wherein the light sensing units correspond to open holes, the light-proof component of the grating is metal, and a circuit part is covered by the metal. The optical fingerprint sensor chip packaging glass grating is simple in structure and process and high in accuracy.

公开/授权文献
0/0