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发明授权
CN104460224B 光掩膜坯料的制造方法 有权

光掩膜坯料的制造方法
摘要：
本发明的课题是涉及一种光掩膜坯料，所述光掩膜坯料在对含有硅的无机膜实施硅烷化处理后形成抗蚀膜，并提供一种光掩膜坯料的制造方法，其能够抑制在显影后因抗蚀剂残渣等所引起的缺陷的产生。为了解决上述问题，提供一种光掩膜坯料的制造方法，其是制造以下的光掩模坯料的方法，所述光掩膜坯料在透明基板上至少具有含有硅的无机膜，并在该无机膜上具有抗蚀膜，所述光掩膜坯料的制造方法是在形成前述无机膜后，以高于200℃的温度，在含有氧气的环境中进行热处理，再进行硅烷化处理，然后利用涂布来形成前述抗蚀膜。
摘要（英）：

The present invention relates to a photomask blank obtained by forming a resist film after performing a silylation process on a silicon-containing inorganic film and provides a method for manufacturing a photomask blank having at least a silicon-containing inorganic film over a transparent substrate and a resist film on the inorganic film, comprising: forming the silicon-containing inorganic film; heat treating the formed silicon-containing inorganic film at a temperature more than 200°C under an atmosphere containing oxygen; performing a silylation process after the heat treatment; and then forming the resist film by application. The method can inhibit generation of defects due to resist residues or the like after development.

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