利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN104766833A 一种LTCC基板正反面布置电路的微波电路三维封装结构 失效 - 权利终止

一种LTCC基板正反面布置电路的微波电路三维封装结构
摘要：
本发明公开了一种LTCC基板正反面布置电路的微波电路三维封装结构，包LTCC基板、支撑铝板和铝腔体，支撑铝板上表面粘接在LTCC基板下表面上，支撑铝板下表面粘接在铝腔体的腔体内，所述支撑铝板为中间镂空的铝框。本发明组装工艺简单，而且对位精度要求低，机械强度高，封装体积小。
摘要（英）：

The invention discloses a microwave circuit three-dimensional encapsulation structure with circuits arranged on the front-back surface of LTCC base plate. The microwave circuit three-dimensional encapsulation structure comprises the LTCC base plate, a support aluminum plate and an aluminum cavity; the upper surface of the support aluminum plate is connected to the lower surface of the LTCC base plate in an adhesive mode, the lower surface of the support aluminum plate is connected to the interior of a cavity body of the aluminum cavity in an adhesive mode, and the support aluminum plate is an aluminum frame of which the middle is hollow. The microwave circuit three-dimensional encapsulation structure is simple in assembly technology, low in alignment precision requirement, high in mechanical strength and small in encapsulation size.

公开/授权文献
0/0