The invention provides an improved template electroplating peeling technology of a conductive line. An insulating substrate is pasted onto one face of a conductive carrier foil, and then one face of the carrier foil is exposed in the external; the exposed face of the carrier foil is preprocessed, a mask is prepared on the exposed face then, and a pattern of a needed conductive line is exposed; a specific anti-stick polysiloxane coating is disposed on a surface of the carrier foil in a dip-coating manner, a dense polysiloxane compound is formed on a surface of the mask and a surface of a mask exposed portion, and then an electroplating template is obtained; by utilizing an electroplating method, a needed type and thickness plating layer is disposed on an exposed portion of the electroplating template in an electro-deposition manner; an adhesive is coated on the a line substrate, and the line substrate and the template after the electroplating are bonded together; and the electroplating template is peeled from the line substrate, the plating layer on the template is transferred to the line substrate, a conductive line is obtained, and then the electroplating template can be used repeatedly. Preparation of the conductive line by utilizing the technology does not need repeat preparation of the mask, corrosion on a metal layer is not needed, reel-to-reel production can be achieved, the improved template electroplating peeling technology has the advantages of simple technology, small pollution, less waste, low cost and the like, and the improved template electroplating peeling technology has great application value.