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发明公开
CN105171270A 钎焊异组分W-Cu合金的钎料及制备方法和钎焊方法 有权 转让

钎焊异组分W-Cu合金的钎料及制备方法和钎焊方法
摘要：
本发明公开了一种钎焊异组分W-Cu合金的钎料及制备方法和钎焊方法，所述钎料各组分及组分的质量百分比分别为Mn10.0％～16.0％，Co0.5％～3.5％，Ni1.0％～5.0％，Ti1.0％～4.0％，Si0.2％～0.6％，B0.1％～0.3％，余量为Cu。本发明的铜基钎料钎焊温度在1000℃～1050℃，钎料熔化温度适中，钎料熔化均匀，通过添加相关有益元素，使得钎料对W-Cu合金具有良好的润湿性和冶金相溶性，获得的钎焊接头强度高，耐蚀性好，完全能应用于复杂环境中，是一种综合性能良好的经济型钎料；制备的铜基钎料箔片有利于促进钎焊连接过程中合金元素的扩散和界面反应，提高钎料在W-Cu合金表面的润湿和铺展能力，有助于形成致密的钎焊接头。
摘要（英）：

The invention discloses a solder for soldering a different-component W-Cu alloy, a preparing method and a soldering method thereof. The mass percents of the components of the solder are described as follows: 10.0-16.0% of Mn, 0.5-3.5% of Co, 1.0-5.0% of Ni, 1.0-4.0% of Ti, 0.2-0.6% of Si, 0.1-.03% of B, and the balance of Cu. The soldering temperature of the copper-based solder is 1000-1050 DEG C. Moderate fusing temperature of the solder and high fusion uniformity of the solder are realized. Through adding related beneficial elements, good wetability and high metallurgical miscibility of the solder to the W-Cu alloy are realized. An obtained solder joint has high strength and high corrosion resistance and can be totally applied in a complicated environment. The solder is an economical solder with high comprehensive performance. A prepared copper-based solder foil has functions of facilitating diffusion and interface reaction between alloy elements in a soldering connecting process, improving wetting and spreading capabilities of the solder on the surface of the W-Cu alloy, and facilitating forming of a compact solder joint.

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