An embodiment of the present invention is a bonding device for bonding a first substrate and a second substrate, said bonding device being provided with: a substrate holding unit that holds a second substrate; an indenter that applies pressure to a back surface of the second substrate by carrying out upward motion; and a substrate holding unit having holding claws for holding the rim portion of the first substrate that can be held so as to face the second substrate with a prescribed space therebetween. The bonding device is characterized in that the indenter applies pressure to a prescribed single point on the second substrate, that point corresponding to a position in which the distance between the bonding surface of the first substrate and the bonding surface of the second substrate is smaller than the distance from the rim portion of the bonding surface of the first substrate to the bonding surface of the second substrate.