The invention discloses a chip embedded-type encapsulation structure with a reinforcing structure and an encapsulation method of the same, which belong to the technical field of semiconductor encapsulation. The chip embedded-type encapsulation structure with the reinforcing structure comprises chip single bodies and a thin film encapsulating body, wherein one or more than one chip single bodies are embedded from the back face into the thin film encapsulating body, the upper surfaces of the chip single bodies and the upper surface of the thin film encapsulating body are covered by an insulated thin film layer I, an opening of the insulated thin film layer I is disposed in the upper surface of a chip electrode, a re-wiring metal layer is formed on the upper surface of the insulated thin film layer, the re-wiring metal layer is respectively electrically connected to the chip electrodes, an input end/output end is disposed on the outmost layer of the re-wiring metal layer, a connecting part is formed at the input end/output end, and the back face of the thin film encapsulating body is equipped with a silicon substrate reinforcing plate. The encapsulation method disclosed by the invention reduces thicknesses of products, increases product reliability and realizes the multi-chip encapsulation structure through wafer-level technological forming.