The invention relates to a preparation method of an integrated circuit chip failure analysis sample. The method includes the following steps: smearing a packaging glue on the integrated circuit chip sample to cover the part required for failure analysis by the packaging glue; heat-curing the sample with packaging glue; and polishing the cured sample until part requiring failure analysis. The method uses cured packaging glue to strengthen the part requiring failure analysis, so as to avoid deformation in the polishing process, and preserve the original appearance. The preparation process does not need expensive equipment and the preparation conditions can be met easily.