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发明公开
CN105407651A 一种电路板上设置阻焊层的方法 有权

一种电路板上设置阻焊层的方法
摘要：
本发明公开了一种电路板上设置阻焊层的方法，所述方法包括：在制作出电路板的外层图形后，对所述电路板贴抗蚀刻膜和曝光显影，使得所述电路板的线路图形区域上预设形成凹槽的区域完全显露；对所述电路板的线路图形区域上预设形成凹槽的区域进行蚀刻，使得所述预设形成凹槽的区域形成凹槽；去除所述抗蚀刻膜，在所述电路板上设置阻焊层。本发明实施例用于解决现有技术中电路板丝印油墨所存在的问题。
摘要（英）：

The invention discloses a method of arranging a solder mask on a circuit board. The method comprises the steps of pasting an etching resistant film onto the circuit board and performing exposure and development after an outer pattern of a circuit board is made, so that a preset region, in which a groove is to be formed, on a circuit pattern region of the circuit board is completely exposed; etching the preset region, in which a groove is to be formed, on the circuit pattern region of the circuit board, so that a groove is formed in the preset region in which the groove is to be formed; and removing the etching resistant film and arranging a solder mask on the circuit board. The embodiment of the invention is used for solving the problem in the silk-screen printing ink of the circuit board in the prior art.

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