The invention provides a crimped IGBT module with variable boss height, comprising a tubular shell and plate-like metal electrodes coaxially arranged at the upper and lower ends of the tubular shell. Grooves are distributed on the inner side of the lower metal electrode, each groove accommodates one boss, and the bottom of each boss is a concave surface which is concave upwardly. A power sub-module is crimped between each boss and the upper metal electrode. The crimped IGBT module provided by the invention has the advantages of simple and compact overall structure, better heat dissipation performance, smaller drive circuit stray parameter and lower requirement on the thickness consistency of molybdenum pieces, chips and silver pieces and the height consistency of the bosses. The using performance of devices is improved.