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发明授权
CN105518179B 反应性溅射装置 有权

反应性溅射装置
摘要：
反应性溅射装置具备阴极装置(18)，阴极装置(18)向化合物膜的形成区域(R1)放射溅射粒子。阴极装置(18)具备：扫描部(27)，其在相对区域(R2)扫描烧蚀区域；以及靶(23)，其形成有烧蚀区域，扫描方向上的长度短于相对区域(R2)。扫描部(27)从开始位置(St)朝向相对区域(R2)扫描烧蚀区域，在开始位置(St)上，扫描方向上的形成区域(R1)的2个端部中的溅射粒子先到达的第1端部(Re1)与靶(23)的第1端部(23e1)的距离(D1)在扫描方向上为150mm以上，靶(23)的第1端部(23e1)在扫描方向上离形成区域的第1端部(Re1)近。
摘要（英）：

This reactive sputtering device comprises a cathode device (18) that emits sputtering particles to a compound film formation region (R1). The cathode device (18) includes: a scanning unit (27) that scans an erosion region in an opposing region (R2); and a target (23) in which the erosion region is formed, and that has a length, in the scanning direction, that is shorter than that of the opposing region (R2). The scanning unit (27) scans the erosion region toward the opposing region (R2) from a starting position (St) where the distance (D1) between a first end (Re1), of the two ends of the formation region (R1) in the scanning direction, at which the sputtering particles arrive first and a first end (23e1) of the target (23) closer to the first end (Re1) of the formation region in the scanning direction is 150 mm or greater in the scanning direction.

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